Perfluoroelastomer (FFKM) Perfrez 9021C
Semiconductor Grade O-Rings
Formulated for the extreme thermal and
chemical environments encountered in the dry
and wet processes typically found in
semiconductor fabrication, Perfrez 9021C
is an advance semiconductor grade high
performance FFKM perfluroelastomer compound
that is used in the manufacturing of o-rings
and sealing components.
Perfrez 9021C properties include low
compression set, the ability to remain
stable all through temperature cycles,
extraordinary chemical and heat resistance
and greatly improved mechanical properties.
In environments where sealing components are
in contact with reactive plasma, Prefrez
9021C is your product of choice.
Special Environment Applications
Perfluroelastomer (FFKM) is the answer for
sealing components that have to perform
under the most severe environments
encountered in semiconductor manufacturing.
Perfrez 9021C is formulated to resist
corrosive acids and oxidizing agents, as
well as degradation from exposure to organic
and inorganic bases. It is designed for
thermal stability and extended service life
at high temperatures of up to 310 degrees C.
Resistance to Plasma
The process of wafer fabrication subject
sealing components to corrosive gases and
reactive plasmas, resulting in weight loss
and severe degradation. Equipment that uses
sealing components in the manufacturing of
semiconductor devices has to ensure that
such seals pass the strict performance
requirements of reduced weight loss and
formation of residue. Contamination is the
result of residue generation due to plasma
attack, and this is harmful to the
semiconductor parts been produced.
Perfrez 9021C resists reactive plasmas and
outperforms other elastomeric sealing
compounds under similar service conditions.
Further enhancement of the properties of
plasma resistance of Perfrez 9021C is
achieved with compounding additives. The end
result is a product with service life time
greatly extended when exposed to reactive
plasmas. Competing perfluroelastomer
products that have not gone through
properties enhancement as Perfrez 9021C do
not exhibit the same superior properties of
reduced degradation and lower weight loss.
Lower Compression Set
The degree to which a material, upon the
release of a sustained force, is able to
exhibit form retention, dimensional
stability and elasticity is referred to as
its compression set resistance. Material
aging increases as temperature is elevated,
and this relates to its compression set
resistance. A lower compression set
resistance is achieved by Perfrez 9021C
under similar thermal service conditions as
compared with other competing products.
Reduced Volume Swell
The absorption of fluid and gases by
elastomeric sealing components such as
o-rings, elastomeric seals and gaskets leads
to its volume swell and degradation. An
elastomeric component's compatibility with
fluid is indicated by its volume swell.
Material toughness and wear resistance
reduces, and friction increases. Service
life is further reduced as a result of
contamination. Chemical compatibility tests
performed on Perfrez 9021C has determined a
lower volume swell as compared with
Chemical and Thermal Resistance
The most demanding service conditions for
sealing components found in semiconductor
fabrication processes are met by Perfrez
9021C, which exhibits exceptional resistance
to extreme temperature and corrosive media.
GMORS offers high performance
perfluoroelastomer sealing components suited
for the most challenging environments in
semiconductor fabrication processes. Contact
our technical service staff today for more
Rubber Industrial Co., Ltd.
No. 15, Kung Yeh East 4th Rd., Lukang, Chang Hua 505, Taiwan, R.O.C.
Mao Rubber Industrial Co., Ltd. All rights reserved.