Perfluoroelastomer (FFKM) Perfrez 9021C Semiconductor Grade O-Rings
Formulated for the extreme thermal and chemical environments encountered by
o-rings in semiconductor fabrication during dry and wet processes, Perfrez 9021C is an advance semiconductor grade high performance FFKM
perfluroelastomer compound that is used in the manufacturing of o-rings and
sealing components.
Perfrez 9021C properties include low compression set, the ability to remain
stable all through temperature cycles, extraordinary chemical and heat
resistance and greatly improved mechanical properties. In environments where
sealing components are in contact with reactive plasma, Prefrez 9021C is
your product of choice.
Special Environment Applications
Perfluroelastomer (FFKM) is the answer for sealing components that have to
perform under the most severe environments encountered in semiconductor
manufacturing. Perfrez 9021C is formulated to resist corrosive acids and
oxidizing agents, as well as degradation from exposure to organic and
inorganic bases. It is designed for thermal stability and extended service
life at high temperatures of up to 310 degrees C.
Resistance to Plasma
The process of wafer fabrication subject sealing components to corrosive
gases and reactive plasmas, resulting in weight loss and severe degradation.
Equipment that uses sealing components in the manufacturing of semiconductor
devices has to ensure that such seals pass the strict performance
requirements of reduced weight loss and formation of residue. Contamination
is the result of residue generation due to plasma attack, and this is
harmful to the semiconductor parts been produced.
Perfrez 9021C resists reactive plasmas and outperforms other elastomeric
sealing compounds under similar service conditions. Further enhancement of
the properties of plasma resistance of Perfrez 9021C is achieved with
compounding additives. The end result is a product with service life time
greatly extended when exposed to reactive plasmas. Competing
perfluroelastomer products that have not gone through properties enhancement
as Perfrez 9021C do not exhibit the same superior properties of reduced
degradation and lower weight loss.
Lower Compression Set
The degree to which a material, upon the release of a sustained force, is
able to exhibit form retention, dimensional stability and elasticity is
referred to as its compression set resistance. Material aging increases as
temperature is elevated, and this relates to its compression set resistance.
A lower compression set resistance is achieved by Perfrez 9021C under
similar thermal service conditions as compared with other competing
products.
Reduced Volume Swell
The absorption of fluid and gases by elastomeric sealing components such as
o-rings, elastomeric seals and gaskets leads to its volume swell and
degradation. An elastomeric component's compatibility with fluid is
indicated by its volume swell. Material toughness and wear resistance
reduces, and friction increases. Service life is further reduced as a result
of contamination. Chemical compatibility tests performed on Perfrez 9021C
has determined a lower volume swell as compared with competing products.
Chemical and Thermal Resistance
The most demanding service conditions for sealing components found in
semiconductor fabrication processes are met by Perfrez 9021C, which exhibits
exceptional resistance to extreme temperature and corrosive media.
Contact Us
GMORS offers high performance perfluoroelastomer sealing components suited
for the most challenging environments in semiconductor fabrication
processes. Contact our technical service staff today for more information.
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